Applied Materials (AMAT) Stock News

Applied Materials and Intel are teaming up to speed development of next-generation transistors, interconnects and advanced packaging for AI workloads. The work will be done at Applied's EPIC Center and Intel's R&D campus in Hillsboro, Oregon. Financial terms were not disclosed.

Applied Materials and Intel announced a collaboration to develop breakthroughs in next-generation transistors, interconnects, and advanced packaging technology for AI chips and systems. The partnership aims to advance semiconductor manufacturing for AI workloads.

Applied Materials and Intel collaborate on chipmaking innovations for AI computing.

Applied Materials and Besi expanded their strategic partnership, with Besi joining Applied's EPIC Center as an Innovation Partner. The collaboration extends co-innovation beyond hybrid bonding into new interconnect architectures for AI-driven semiconductor scaling, including die-to-wafer hybrid bonding, TCB scaling, die-on-panel integration, and photonics-enabled interconnects.

Applied Materials and KIOXIA will collaborate at Applied's EPIC Center on advanced memory-cell and structure creation, multi-chip stacking architectures, and new materials engineering. The partnership aims to increase memory density and performance for AI. Applied's $5 billion EPIC Center in Silicon Valley is the largest U.S. investment in semiconductor equipment R&D.

Applied Materials beat Q3 estimates on revenue, EPS, operating income, and free cash flow. Q4 guidance came in well above consensus. Management raised its calendar 2026 Semiconductor Systems revenue outlook and expects another strong year in 2027.