- Besi joins Applied's EPIC Center as an Innovation Partner
- Expanded co-innovation scope includes new interconnect architectures beyond hybrid bonding
- Focus areas: die-to-wafer hybrid bonding, TCB scaling, die-on-panel integration, photonics-enabled interconnects
- Applied's EPIC Center is a $5 billion R&D investment in Silicon Valley
- Partnership builds on 2020 joint development program and Singapore Center of Excellence
- Applied Materials and Besi expanded their strategic partnership, with Besi joining Applied's EPIC Center as an Innovation Partner. The collaboration extends co-innovation beyond hybrid bonding into new interconnect architectures for AI-driven semiconductor scaling. Focus areas include die-to-wafer hybrid bonding, thermo-compression bonding scaling, die-on-panel integration, and photonics-enabled interconnects. Applied's EPIC Center in Silicon Valley represents a $5 billion R&D investment.
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