VSMC, the NXP-VIS joint venture, celebrated the grand opening of its first 300mm fab in Singapore. The facility has entered risk production with yields above 99% and is on track for volume production in Q1 2027. Full capacity by 2029 is expected at 44,000 wafers per month, supporting 130nm to 40nm process technologies for mixed-signal, power, analog, and interposer applications.
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