TE Connectivity (TEL) is investing over $60 million in a new R&D and manufacturing facility in Henrietta, New York, to develop next-generation fiber optic solutions for hyperscale AI data centers and cloud providers. The 135,000-square-foot facility will produce high-density fiber array units acquired from RAM Photonics, targeting performance and density bottlenecks in co-packaged optics. The facility is expected to open in spring 2027 and ramp through 2031, creating more than 800 jobs.
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